Optimal for fine grinding of samples with a hardness of 150 HV – 2000 HV.

Aka-Piatto 600+/30 µm and 1200+/15 µm for fine grinding are used to remove the deformation created by an Aka-Piatto plane grinding step.

Due to the higher diamond concentration Piatto+ grinds more gently and is therefore better suited for grinding of brittle samples like ceramics, cermets and sintered carbides than the regular Aka-Piatto.

After the use of an Aka-Piatto 600+/30 µm and 1200+/15 µm for fine grinding, the samples are ready for a 3 µm polishing step.